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Your search returned 20 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A
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Year : 1995 Volume number : 18 Issue: 03 |
Advanced Low-Cost Bare-Die Packaging Technology For Liquid Crystal Displays
(Article)
Subject:
Lcd Driver
,
Tab
,
Cog
Author:
Jackson C.
Hwang
page:
458
-
461
Low-Cost Multichip Modules
(Article)
Subject:
Multichip Modules
,
Automotive Electronic Systems
,
Chip On Pcb
Author:
Michael
Dobers
Martin
Seyffert
page:
462
-
465
Quick Inspection Of Power-Plane Short Fault On Multilayer Substrate
(Article)
Subject:
Inspection
,
Multichip Modules
,
Multilayer Structure
Author:
Fang-Lin
Chao
Ruey-Beei
Wu
page:
466
-
470
Low Temperature Plasma Deposition Of Silicon Nitride To Produce Ultra-Reliable High Performance Low Cost Sealed Chip-On-Boand (Scob) Assemblies
(Article)
Subject:
Temperature Plasma
,
High Performance
Author:
Ronald M.
Kubacki
page:
471
-
477
In-Situ Prediction Of Reactive Ion Etch Endpoint Using Neural Networks
(Article)
Subject:
In-Situ Activation
,
Neural Network
Author:
Christopher D.
Himmel
Michael D.
Baker
page:
478
-
483
Capacity Utilization Bottleneck Efficiency System Cubes
(Article)
Subject:
Production Cost
,
Capacity Placement
,
Workload
Author:
John M.
Konopka
page:
484
-
491
Sequential Experiments To Characterize Processing Equipment Maximizing Information Content While Restraining Costs
(Article)
Subject:
Sequence Batch Reactor
,
Restrained Shrikage
Author:
Jack E.
Reece
page:
492
-
499
Gas-Assisted Evaporative Cooling Of High Density Electronic Modules
(Article)
Subject:
Cooling
,
Evaporation
,
Immersion
Author:
Avram
Bar-Cohen
Greg
Sherwood
page:
502
-
509
Single-Phase And Boiling Cooling Of Small Pin Fin Arrays By Multiple Slot Nozzle Suction And Impingement
(Article)
Subject:
Boiling
,
Pin-On-Disc
,
Multiple Lut
Author:
David
Copeland
page:
510
-
516
Coarse And Detailed Cfd Modeling Of A Finned Heat Sink
(Article)
Subject:
Detailed Kinetics
,
Heat Sink
Author:
Ronald L.
Linton
page:
517
-
520
Thermal Limitation In Optical Recording
(Article)
Subject:
Optical Receiver
,
Laser Annealing
,
Thermal Analysis
Author:
Douglas J.
Nelson
Brian
Vick
page:
521
-
526
Jet Impingement Boiling Of A Dielectric Coolant In Narrow Gaps
(Article)
Subject:
Jet Impingement
,
Narrow Size
Author:
Gregory
Chrysler
Robert E.
Simons
page:
527
-
533
Effect Of Channel Width On Pool Boiling From A Microconigured Heat Sink
(Article)
Subject:
Pool Boiling
,
Silicon
,
Electronic Cooling
Author:
Ronald M.
Nowell
Sushil H.
Bhavnani
page:
534
-
539
Finding Unknown Surface Temperatures And Heat Fluxes In Steady Heat Conduction
(Article)
Subject:
Heat Transfer
,
Inverse Problem
,
Boundary Conditions
Author:
Thomas L.
Martin
G. S
Dulikravich
page:
540
-
545
Entrance Analysis Of Turbulent Flow In An Array Heated Rectangular Blocks
(Article)
Subject:
Models
,
Numerical Solutions
Author:
Mohammad
Faghri
M
Molki
Y
Asako
page:
546
-
552
Thermap Ka Thermal Model For Mictoprocessors
(Article)
Subject:
Temperature
,
Thermal
,
Model
,
Cad
Author:
Johan
Liu
Louis
Monier
page:
553
-
558
Thermal Modeling Of Lsothermal Cuboids And Rectangular Heat Sinks Cooled By Natural Convection
(Article)
Subject:
Thermal Modeling
,
Isothermal Aging
Author:
J. Richard
Culham
M. Michael
Yovanovich
page:
559
-
566
Concurrent Design And Analysis Of The Navigator Wearable Computer System The Thermal Perspective
(Article)
Subject:
Wearable Computers
,
Thermal Measurement
Author:
Cristina. H
Amon
D. P.
Siewiorek
Asim
Smailagic
page:
567
-
577
A Shear-Optimization Of Adhesive Thickness For Die Bonding
(Article)
Subject:
Die Bond
,
Fe
,
Shear Strength
Author:
Kari E.
Hokanson
Avram
Bar-Cohen
page:
578
-
584
Nonlinear Finite Element Simulation Of Thermoviscoplastic Deformation Of C4 Solder Joints In High Density Packaging Under Thermal Cycling
(Article)
Subject:
Finite - Element Analysis
,
Thermal Cycle Stability
,
Solder Joint Reliability
Author:
Bor Zen
Hong
Lloyd G.
Burrell
page:
585
-
591
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